| Name of the Equipment | STSRIE |
| Category | semi clean a |
| Operator | Pankajkumar Gound Shilpa Kharat |
| System Owner | Shilpa Kharat 30003402@iitb.ac.in |
| Short Name | |
| Make | STS/ 320 PC |
| Model | Yes |
| Serial Number | |
| FootPrint | |
| InstallationDate | |
| Equipment Type | Reactive Ion Etch |
| Location | 17 |
| AMC | Required |
| Local Dealer | |
| Actual Dealer | M/s. CTP Company Services. M/s. CTP Company Services., 3 Commercial Road, Cwmfelinfach, Near Newport, Gwent, NP11-7HW, U.K. Mob: 7754002875 Email: gareth.morgan@homecall.co.uk |
| SOP | SOP/93_SOP.pdf |
| Training & other policy documents | POLICY/93_POLICY.pdf |
| Recipies | RECEPIES/93_RECEPIES.pdf |
| Glimpse | GLIMPSE/93_GLIMPSE.pdf |
| Tool Facilities Requirements | chiller, Nitrogen gas(GN2, PN2) and process gases CF4, SF6, CHF3, O2 |
| Access | Open |
| Lab Phone No | 4493 |
| Substrate allowed | Si, Ge, GeSn, Diamond |
| Substrate Dimension | Pieces to 6 inch wafer |
| Material allowed | SiO2, Si, Ge, Photoresists, HfO2, Al2O3, TiO2, NbN, Pt |
| Chemical allowed | NA |
| Elements allowed | |
| Target allowed | NA |
| Target dimension | NA |
| Gases allowed | SF6, CF4, CHF3, O2, N2 |
| Contamination remarks | Only Pt is allowed for inside the chamber as hard mask. Metal etching is not allowed. |
Equipment Details |
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