| Name of the Equipment | Plasma asher |
| Category | gold contaminated |
| Operator | Shilpa Kharat Minita Surwade (NH) Manisha Bansode |
| System Owner | Manisha Bansode manishak@ee.iitb.ac.in Shilpa Kharat 30003402@iitb.ac.in |
| Short Name | |
| Make | Fabricated in CEN/ NA |
| Model | Yes |
| Serial Number | NA |
| FootPrint | width=0.69m, Depth 1.2m, Height 1.56m |
| InstallationDate | 2007 |
| Equipment Type | Reactive Ion Etch |
| Location | 21 |
| AMC | Required |
| Local Dealer | NA NA |
| Actual Dealer | NA NA |
| SOP | SOP/87_SOP.pdf |
| Training & other policy documents | |
| Recipies | |
| Glimpse | GLIMPSE/87_GLIMPSE.pdf |
| Tool Facilities Requirements | Water connection, Oxygen, CHF3 |
| Access | Open |
| Lab Phone No | 4488 Ext Flash 107 OR 111 |
| Substrate allowed | Quartz, Si |
| Substrate Dimension | maximun size 2 inch |
| Material allowed | ppr, su8, cblack, PDMS, PMMA, metals, oxides, Polymer(VDF-TrFe0/ BaTiO3 |
| Chemical allowed | NA |
| Elements allowed | |
| Target allowed | NA |
| Target dimension | NA |
| Gases allowed | Oxygen, CF4, CHF3 |
| Contamination remarks | Powdered material not allowed. And Na+ and K+ are not allowed. For outside/ NCPRE/ Org electronics lab samples, contact SO/ Process engineer. |
Equipment Details |
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